| 住所 | 〒- Taiwan |
|---|---|
| TEL | +886-37-586200 |
| FAX | +886-37-586277 |
| URL | http://www.coreopticstech.com |
| alan.tan@coreopticstech.com | |
| 設立年 | 20180424年 |
| 資本金 | 6,800,000円 |
| 従業員数 | 30名 |
| Chairman | Yim |
| 最終更新日:2025年02月20日 |
| 住所 | 〒- Taiwan |
|---|---|
| TEL | +886-37-586200 |
| FAX | +886-37-586277 |
| URL | http://www.coreopticstech.com |
| alan.tan@coreopticstech.com | |
| 設立年 | 20180424年 |
| 資本金 | 6,800,000円 |
| 従業員数 | 30名 |
| Chairman | Yim |
| 最終更新日:2025年02月20日 |
Our Short-Wavelength-Infrared (SWIR) 1310nm/1460nm HCSEL chip achieves 400mW output power. The HCSEL is available as bare chip or in 0402 SMD package. Target applications include under-display proximity sensing in smartphones, bio-sensing, and other wearable devices. Currently, the 1310nm HCSEL has been successfully implemented to the mobile phone supply chain.
The 1310nm DFB-HCSEL offers high power continuous wave output, making it suitable as a light source for optical engines in transceiver modules. Its surface-emitting feature provides significant advantages for integration into photonic integrated circuits (PICs).
*Top-side or Back-side emission
*Selective Oxidation VCSEL.
*Suitable for high speed fiber communication application. Data rates up to 25Gb/s
*Low threshold and operating current
*Anode and cathode bond pad on front side.
*Operation temperature 0~85℃
*40um optical detection mesa area.
*Top-side illuminated device.
*AR coating for wide wavelength range.
*High cut-off frequency.
*Low dark current and capacitance.