| 住所 | 〒- No. 22 Aigehao Road, Xiangcheng District, Suzhou City,Jiangsu Province, China |
|---|---|
| TEL | 0512-65486261 |
| FAX | |
| URL | http://www.bhy-sz.com |
| bohong@bhy-sz.com | |
| 設立年 | 2016年 |
| 従業員数 | 208名 |
| Xia erjuan | |
| 最終更新日：2026年03月27日 |
Our company specializes in the research, development, manufacturing and sales of various high-precision single-sided and double-sided grinding and polishing equipment, single-sided and double-sided thinning equipment, and edge polishing machines.
This series of products is mainly used for sapphire,
silicon carbide, blue glass, ceramics, cr ystals,
semiconductors, metals and other hard and brittle
materials of high precision double-sided grinding and
polishing, especially for large pressure, ultra-light
pressure, large size ultra-thin workpiece processing has
obvious advantages. It can meet the requirements of
high flatness and high parallelism. Can provide
equipment, process, accessories and professional
services as one of the solutions.
This series of products is mainly used for sapphire,
silicon carbide, blue glass, ceramics, cr ystals,
semiconductors, metals and other hard and brittle
materials of high precision double-sided grinding and
polishing, especially for large pressure, ultra-light
pressure, large size ultra-thin workpiece processing has
obvious advantages. It can meet the requirements of
high flatness and high parallelism. Can provide
equipment, process, accessories and professional
services as one of the solutions.
This series of products is mainly used for sapphire,
silicon carbide, blue glass, ceramics, cr ystals,
semiconductors, metals and other hard and brittle
materials of high precision double-sided grinding and
polishing, especially for large pressure, ultra-light
pressure, large size ultra-thin workpiece processing has
obvious advantages. It can meet the requirements of
high flatness and high parallelism. Can provide
equipment, process, accessories and professional
services as one of the solutions.
This series of products is mainly used for sapphire,
silicon carbide, blue glass, ceramics, cr ystals,
semiconductors, metals and other hard and brittle
materials of high precision double-sided grinding and
polishing, especially for large pressure, ultra-light
pressure, large size ultra-thin workpiece processing has
obvious advantages. It can meet the requirements of
high flatness and high parallelism. Can provide
equipment, process, accessories and professional
services as one of the solutions.
This series of products is mainly used for sapphire,
silicon carbide, blue glass, ceramics, cr ystals,
semiconductors, metals and other hard and brittle
materials of high precision double-sided grinding and
polishing, especially for large pressure, ultra-light
pressure, large size ultra-thin workpiece processing has
obvious advantages. It can meet the requirements of
high flatness and high parallelism. Can provide
equipment, process, accessories and professional
services as one of the solutions.
